Invention Grant
- Patent Title: Semiconductor strain gauge and the manufacturing method
- Patent Title (中): 半导体应变片及其制造方法
-
Application No.: US11799412Application Date: 2007-05-01
-
Publication No.: US07666699B2Publication Date: 2010-02-23
- Inventor: Ikuo Hakomori , Yuji Nakamura , Keiichi Nakanishi , Koichi Ida
- Applicant: Ikuo Hakomori , Yuji Nakamura , Keiichi Nakanishi , Koichi Ida
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Tanita Corporation,Toko, Inc
- Current Assignee: Tanita Corporation,Toko, Inc
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Jordan and Hamburg LLP
- Priority: JP2006-127267 20060501
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.
Public/Granted literature
- US20070254387A1 Semiconductor strain gauge and the manufacturing method Public/Granted day:2007-11-01
Information query
IPC分类: