Invention Grant
US07666713B2 Method for bonding heatsink and semiconductor device with heatsink
失效
散热片和半导体器件与散热片的接合方法
- Patent Title: Method for bonding heatsink and semiconductor device with heatsink
- Patent Title (中): 散热片和半导体器件与散热片的接合方法
-
Application No.: US11387769Application Date: 2006-03-24
-
Publication No.: US07666713B2Publication Date: 2010-02-23
- Inventor: Hideki Kimura
- Applicant: Hideki Kimura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A simple method for bonding a heatsink for improving heat-radiating efficiency, comprising the steps of sticking a double-sided adhesive tape to an end portion on an adhesion surface of at least either the heatsink or the semiconductor device; applying an adhesive onto the adhesion surface of at least either the heatsink or the semiconductor device; bringing the end portion into contact with a corresponding portion of the other one of the heatsink or the semiconductor device; and turning at least either the heatsink or the semiconductor device with the contacting portion as a rotation center to bond together the adhesion surfaces of the heatsink and the semiconductor device.
Public/Granted literature
- US20070224734A1 Method for bonding heatsink and semiconductor device with heatsink Public/Granted day:2007-09-27
Information query
IPC分类:
