Invention Grant
- Patent Title: Assembly of thin die coreless package
- Patent Title (中): 组装薄芯无芯封装
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Application No.: US11648120Application Date: 2006-12-29
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Publication No.: US07666714B2Publication Date: 2010-02-23
- Inventor: Daoqiang Lu , Rajashree Baskaran , Charan Gurumurthy
- Applicant: Daoqiang Lu , Rajashree Baskaran , Charan Gurumurthy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Caven & Aghevli LLC
- Main IPC: H01L21/58
- IPC: H01L21/58
Abstract:
In one embodiment, a method comprises coupling a coreless substrate panel to a pressure cover plate of a carrier, applying flux to the coreless substrate panel, placing at least one die on the coreless substrate panel, reflowing solder onto the coreless substrate panel, defluxing the coreless substrate panel, underfilling the coreless substrate panel, and attaching at least one heat spreader to the coreless substrate panel.
Public/Granted literature
- US20080160673A1 Assembly of thin die coreless package Public/Granted day:2008-07-03
Information query
IPC分类:
