Invention Grant
US07666722B2 Manufacturing method of semiconductor device, and IC card, IC tag, RFID, transponder, bill, securities, passport, electronic apparatus, bag, and garment
有权
半导体器件制造方法，IC卡，IC标签，RFID，应答器，票据，证券，护照，电子仪器，袋子和服装
- Patent Title: Manufacturing method of semiconductor device, and IC card, IC tag, RFID, transponder, bill, securities, passport, electronic apparatus, bag, and garment
- Patent Title (中): 半导体器件制造方法，IC卡，IC标签，RFID，应答器，票据，证券，护照，电子仪器，袋子和服装
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Application No.: US10588989Application Date: 2005-02-15
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Publication No.: US07666722B2Publication Date: 2010-02-23
- Inventor: Jun Koyama
- Applicant: Jun Koyama
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-045480 20040220
- International Application: PCT/JP2005/002680 WO 20050215
- International Announcement: WO2005/081307 WO 20050901
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The present invention provides a manufacturing method of a semiconductor device used as an ID chip, by which data can be written with improved throughput. According to the manufacturing method of a semiconductor device having a modulation circuit, a demodulation circuit, a logic circuit, a memory circuit, and an antenna circuit over an insulating substrate, the memory circuit is a nonvolatile memory circuit of which data is written in the manufacture of the semiconductor device, and elements in a data portion are formed by electron beam exposure or laser exposure while the other portions are formed by mirror projection exposure, step and repeat exposure, or step and scan exposure.
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