Invention Grant
- Patent Title: Methods of fabricating semiconductor devices including transistors having recessed channels
- Patent Title (中): 制造包括具有凹槽的晶体管的半导体器件的方法
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Application No.: US11704872Application Date: 2007-02-09
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Publication No.: US07666743B2Publication Date: 2010-02-23
- Inventor: Jin-Woo Lee , Tae-Young Chung , Sung-Hee Han
- Applicant: Jin-Woo Lee , Tae-Young Chung , Sung-Hee Han
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2006-0058818 20060628
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Semiconductor devices including an isolation layer on a semiconductor substrate are provided. The isolation layer defines an active region of the semiconductor substrate. The device further includes an upper gate electrode crossing over the active region and extending to the isolation layer and lower active gate electrode. The lower active gate electrode includes a first active gate electrode extending from the upper gate electrode to the active region and a second active gate electrode below the first active gate electrode and having a greater width than a width of the first active gate electrode. The device further includes a lower field gate electrode that extends from the upper gate electrode to the isolation layer and has a bottom surface that is at a lower level than a bottom surface of the active gate electrode such that the sidewalls of the active region are covered below the lower active gate electrode. Related methods of fabricating semiconductor devices are also provided herein.
Public/Granted literature
- US20080001230A1 Semiconductor devices including transistors having recessed channels and methods of fabricating the same Public/Granted day:2008-01-03
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