Invention Grant
US07666744B2 Method of manufacturing a semiconductor device having a trench surrounding plural unit cells
有权
制造具有围绕多个单电池的沟槽的半导体器件的方法
- Patent Title: Method of manufacturing a semiconductor device having a trench surrounding plural unit cells
- Patent Title (中): 制造具有围绕多个单电池的沟槽的半导体器件的方法
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Application No.: US12165991Application Date: 2008-07-01
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Publication No.: US07666744B2Publication Date: 2010-02-23
- Inventor: Kenya Kobayashi
- Applicant: Kenya Kobayashi
- Applicant Address: JP Kanagawa
- Assignee: NEC Electronics Corporation
- Current Assignee: NEC Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Young & Thompson
- Priority: JP2003-432376 20031226
- Main IPC: H01L21/8236
- IPC: H01L21/8236

Abstract:
A semiconductor device comprises a plurality of unit cells, each comprising a vertical metal oxide semiconductor field effect transistor (MOSFET). The unit cell includes a first source region formed in a first base region, a second source region formed in the first base region and separated from the first source region, and a second base region formed in the first base region and disposed between the first and second source regions. The semiconductor device further comprises a trench gate formed in a vicinity of each of the plurality of unit cells. The second base region of an unit cell is separated from the second base region of an adjacent unit cell, and the first or second source region of an unit cell is separated from the first or second source region of an adjacent unit cell.
Public/Granted literature
- US20080274599A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH SURROUNDING PLURAL UNIT CELLS Public/Granted day:2008-11-06
Information query
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