Invention Grant
US07666748B2 Method of forming amorphous source/drain extensions 有权
形成非晶源极/漏极延伸部分的方法

  • Patent Title: Method of forming amorphous source/drain extensions
  • Patent Title (中): 形成非晶源极/漏极延伸部分的方法
  • Application No.: US11614300
    Application Date: 2006-12-21
  • Publication No.: US07666748B2
    Publication Date: 2010-02-23
  • Inventor: Amitabh Jain
  • Applicant: Amitabh Jain
  • Applicant Address: US TX Dallas
  • Assignee: Texas Instruments Incorporated
  • Current Assignee: Texas Instruments Incorporated
  • Current Assignee Address: US TX Dallas
  • Agent Rose Alyssa Keagy; Wade J. Brady, III; Frederick J. Telecky, Jr.
  • Main IPC: H01L21/336
  • IPC: H01L21/336
Method of forming amorphous source/drain extensions
Abstract:
A method for making a transistor within a semiconductor wafer. The method may include etching a recess at source/drain extension locations and depositing amorphous silicon within the recess to from amorphous silicon source/drain extensions. Dopants may be implanted into the amorphous silicon source/drain extensions and the semiconductor wafer may then be annealed.
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