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US07666790B2 Silicide gate field effect transistors and methods for fabrication thereof 失效
硅化物栅场效应晶体管及其制造方法

Silicide gate field effect transistors and methods for fabrication thereof
Abstract:
A method for fabricating a silicide gate field effect transistor includes masking a silicon source/drain region prior to forming the silicide gate by annealing a metal silicide forming metal layer contacting a silicon-containing gate. The silicide gate may be either a fully silicided gate or a partially silicided gate. After unmasking the source/drain region a silicide layer may be formed upon the source/drain region, and also upon the partially silicided gate. The second silicide layer and the partially silicided gate also provide a fully silicided gate.
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