Invention Grant
- Patent Title: Silicide gate field effect transistors and methods for fabrication thereof
- Patent Title (中): 硅化物栅场效应晶体管及其制造方法
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Application No.: US11380528Application Date: 2006-04-27
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Publication No.: US07666790B2Publication Date: 2010-02-23
- Inventor: Zhijiong Luo , William K. Henson , Christian Lavoie , Huilong Zhu
- Applicant: Zhijiong Luo , William K. Henson , Christian Lavoie , Huilong Zhu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent H. Daniel Schnurmann
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A method for fabricating a silicide gate field effect transistor includes masking a silicon source/drain region prior to forming the silicide gate by annealing a metal silicide forming metal layer contacting a silicon-containing gate. The silicide gate may be either a fully silicided gate or a partially silicided gate. After unmasking the source/drain region a silicide layer may be formed upon the source/drain region, and also upon the partially silicided gate. The second silicide layer and the partially silicided gate also provide a fully silicided gate.
Public/Granted literature
- US20070254478A1 SILICIDE GATE FIELD EFFECT TRANSISTORS AND METHODS FOR FABRICATION THEREOF Public/Granted day:2007-11-01
Information query
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