Invention Grant
- Patent Title: Semiconductor integrated circuit device and method of manufacturing the same
- Patent Title (中): 半导体集成电路器件及其制造方法
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Application No.: US11289410Application Date: 2005-11-30
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Publication No.: US07667218B2Publication Date: 2010-02-23
- Inventor: Naoki Yamamoto , Norikatsu Takaura , Yuichi Matsui , Nozomu Matsuzaki , Kenzo Kurotsuchi , Motoyasu Terao
- Applicant: Naoki Yamamoto , Norikatsu Takaura , Yuichi Matsui , Nozomu Matsuzaki , Kenzo Kurotsuchi , Motoyasu Terao
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2004-348647 20041201
- Main IPC: H01L47/00
- IPC: H01L47/00 ; H01L29/76 ; H01L27/108 ; H01L29/94 ; H01L29/00

Abstract:
Disclosed herein is a phase change memory semiconductor integrated circuit device using a chalcogenide film that solves a problem that the operation temperature capable of ensuring long time memory retention is low due to low phase change temperature is and, at the same time, a problem that power consumption of the device is high since a large current requires to rewrite memory information due to low resistance. A portion of constituent elements for a chalcogenide comprises nitride, oxide or carbide which are formed to the boundary between the chalcogenide film and a metal plug as an underlying electrode and to the grain boundary of chalcogenide crystals thereby increasing the phase change temperature and high Joule heat can be generated even by a small current by increasing the resistance of the film.
Public/Granted literature
- US20060113520A1 Semiconductor integrated circuit device and method of manufacturing the same Public/Granted day:2006-06-01
Information query
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