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US07667231B2 Automatic on-die defect isolation 有权
自动模内缺陷隔离

Automatic on-die defect isolation
Abstract:
Microcircuits may include polysilicon features that are vulnerable to defects due to undesirable phenomena during manufacturing processes such as, inter alia, over-etching. The same phenomena that may cause defects can be exploited to automatically isolate the affected circuit and thus limit the harm caused by defects or incipient defects.
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