Invention Grant
- Patent Title: High density memory array having increased channel widths
- Patent Title (中): 具有增加的通道宽度的高密度存储器阵列
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Application No.: US11811502Application Date: 2007-06-11
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Publication No.: US07667234B2Publication Date: 2010-02-23
- Inventor: Hongmei Wang , Chandra Mouli , Luan Tran
- Applicant: Hongmei Wang , Chandra Mouli , Luan Tran
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc
- Current Assignee: Micron Technology, Inc
- Current Assignee Address: US ID Boise
- Agency: Fletcher Yoder
- Main IPC: H01L29/04
- IPC: H01L29/04

Abstract:
A memory array having decreased cell sizes and having transistors with increased channel widths. More specifically, pillars are formed in a substrate such that sidewalls are exposed. The sidewalls of the pillars and the top surface of the pillars are covered with a gate oxide and a polysilicon layer to form a channel through the pillars. The current path through the channel is approximately equal to twice the height of the pillar plus the width of the pillar. The pillars are patterned to form non-linear active area lines having angled segments. The polysilicon layer is patterned to form word lines that intersect the active area lines at the angled segments.
Public/Granted literature
- US20070241395A1 High density memory array having increased channel widths Public/Granted day:2007-10-18
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