Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12071887Application Date: 2008-02-27
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Publication No.: US07667274B2Publication Date: 2010-02-23
- Inventor: Kazuaki Nakajima , Kyoichi Suguro
- Applicant: Kazuaki Nakajima , Kyoichi Suguro
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2002-323493 20021107
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/78

Abstract:
A semiconductor device is disclosed, which comprises a silicon substrate, a complementary MISFET circuit, an insulation film formed on the silicon substrate, a first contact hole formed in the insulation film, a first metal silicide layer formed on the bottom of the first contact hole, the first metal silicide layer being provided by a reaction of the n-channel impurity diffused region of the n-channel MISFET with a first metal, a second contact hole formed in the insulation film, a second metal silicide layer formed on the bottom of the second contact hole, the second metal silicide layer being provided by a reaction of the p-channel impurity diffused region of the p-channel MISFET with a second metal, and a work function of the second metal silicide layer being higher than that of the first metal silicide layer.
Public/Granted literature
- US20080157214A1 Semiconductor device and method of manufacturing the same Public/Granted day:2008-07-03
Information query
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