Invention Grant
- Patent Title: Spaced, bumped component structure
- Patent Title (中): 间距，碰撞的部件结构
-
Application No.: US11272564Application Date: 2005-11-10
-
Publication No.: US07667323B2Publication Date: 2010-02-23
- Inventor: Oliver Kierse , John O'Dowd , John Wynne , William Hunt , Eamon Hynes , Peter Meehan
- Applicant: Oliver Kierse , John O'Dowd , John Wynne , William Hunt , Eamon Hynes , Peter Meehan
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Sunstein Kann Murphy & Timbers LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/34
Abstract:
A spaced, bumped component structure including a first plate, a second plate spaced from the first plate by a first gap, a plurality of solder bumps interconnecting the plates and defining the first gap; at least one of the plates having an anomalous section including one of a raised platform and recess for defining a second gap having a different size from the first gap.
Public/Granted literature
- US20060163726A1 Spaced, bumped component structure Public/Granted day:2006-07-27
Information query
IPC分类:
