Invention Grant
- Patent Title: Semiconductor device with conductive die attach material
- Patent Title (中): 具有导电芯片的半导体器件附着材料
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Application No.: US11858627Application Date: 2007-09-20
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Publication No.: US07667337B2Publication Date: 2010-02-23
- Inventor: Joachim Mahler , Thomas Behrens , Stefan Landau , Eduard Knauer , Rupert Fischer
- Applicant: Joachim Mahler , Thomas Behrens , Stefan Landau , Eduard Knauer , Rupert Fischer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.
Public/Granted literature
- US20090079088A1 SEMICONDUCTOR DEVICE WITH CONDUCTIVE DIE ATTACH MATERIAL Public/Granted day:2009-03-26
Information query
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