Invention Grant
US07667374B2 Ultrasonic transducer, ultrasonic probe and method for fabricating the same
有权
超声波换能器,超声波探头及其制造方法
- Patent Title: Ultrasonic transducer, ultrasonic probe and method for fabricating the same
- Patent Title (中): 超声波换能器,超声波探头及其制造方法
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Application No.: US11657186Application Date: 2007-01-23
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Publication No.: US07667374B2Publication Date: 2010-02-23
- Inventor: Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
- Applicant: Takanori Aono , Tatsuya Nagata , Hiroyuki Enomoto , Shuntaro Machida
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Townsend and Townsend and Crew LLP
- Priority: JP2006-081897 20060324
- Main IPC: H01L41/00
- IPC: H01L41/00

Abstract:
In an ultrasonic transducer including a gap between an upper electrode and a lower electrode on a silicon substrate, it is made possible to reduce or adjust warpage of an above-gap membrane vibrated by electrostatic actuation due to internal stress. A fourth insulating film and a fifth insulating film of films positioned above the gap which is a cavity required for transmitting and receiving ultrasonic are respectively a silicon oxide film for compression stress and a silicon nitride film for tensile stress. Therefore, compression stress and tensile stress cancel each other, so that warpage of the above-gap membrane is reduced. An amount of warpage can be adjusted by adjusting a film thickness of the fourth insulating film and a film thickness of the fifth insulating film.
Public/Granted literature
- US20070222338A1 Ultrasonic transducer, ultrasonic probe and method for fabricating the same Public/Granted day:2007-09-27
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