Invention Grant
- Patent Title: Encapsulation structure of double sided organic light emitting device and method of fabricating the same
- Patent Title (中): 双面有机发光器件的封装结构及其制造方法
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Application No.: US11397801Application Date: 2006-04-05
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Publication No.: US07667396B2Publication Date: 2010-02-23
- Inventor: Ching-Ian Chao
- Applicant: Ching-Ian Chao
- Applicant Address: TW Hsin-Chu
- Assignee: Au Optronics Corp.
- Current Assignee: Au Optronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Agency: Rabin & Berdo, PC
- Priority: TW94142672A 20051202
- Main IPC: H01J1/62
- IPC: H01J1/62

Abstract:
An encapsulation structure of double sided organic light emitting device (OLED) comprises a first substrate and a second substrate disposed oppositely; a first organic light emitting device (OLED) disposed on the first substrate; a second OLED disposed on the second substrate; a supporter disposed between the first OLED and the second OLED; and at least a moisture absorption layer disposed at the supporter for absorbing moisture inside the encapsulation structure.
Public/Granted literature
- US20070126354A1 Encapsulation structure of double sided organic light emitting device and method of fabricating the same Public/Granted day:2007-06-07
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