Invention Grant
US07667396B2 Encapsulation structure of double sided organic light emitting device and method of fabricating the same 有权
双面有机发光器件的封装结构及其制造方法

  • Patent Title: Encapsulation structure of double sided organic light emitting device and method of fabricating the same
  • Patent Title (中): 双面有机发光器件的封装结构及其制造方法
  • Application No.: US11397801
    Application Date: 2006-04-05
  • Publication No.: US07667396B2
    Publication Date: 2010-02-23
  • Inventor: Ching-Ian Chao
  • Applicant: Ching-Ian Chao
  • Applicant Address: TW Hsin-Chu
  • Assignee: Au Optronics Corp.
  • Current Assignee: Au Optronics Corp.
  • Current Assignee Address: TW Hsin-Chu
  • Agency: Rabin & Berdo, PC
  • Priority: TW94142672A 20051202
  • Main IPC: H01J1/62
  • IPC: H01J1/62
Encapsulation structure of double sided organic light emitting device and method of fabricating the same
Abstract:
An encapsulation structure of double sided organic light emitting device (OLED) comprises a first substrate and a second substrate disposed oppositely; a first organic light emitting device (OLED) disposed on the first substrate; a second OLED disposed on the second substrate; a supporter disposed between the first OLED and the second OLED; and at least a moisture absorption layer disposed at the supporter for absorbing moisture inside the encapsulation structure.
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