Invention Grant
- Patent Title: Probe assembly, method of producing it and electrical connecting apparatus
- Patent Title (中): 探头组件及其制造方法及电气连接装置
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Application No.: US11912872Application Date: 2005-05-23
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Publication No.: US07667472B2Publication Date: 2010-02-23
- Inventor: Kiyotoshi Miura , Hidehiro Kiyofuji , Yuji Miyagi , Shinji Kuniyoshi , Hitoshi Sato
- Applicant: Kiyotoshi Miura , Hidehiro Kiyofuji , Yuji Miyagi , Shinji Kuniyoshi , Hitoshi Sato
- Applicant Address: JP Musashino-shi, Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Musashino-shi, Tokyo
- Agency: Ingrassia Fisher & Lorenz, P.C.
- International Application: PCT/JP2005/009812 WO 20050523
- International Announcement: WO2006/126279 WO 20061130
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/26
Abstract:
A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.
Public/Granted literature
- US20090058440A1 PROBE ASSEMBLY, METHOD OF PRODUCING IT AND ELECTRICAL CONNECTING APPARATUS Public/Granted day:2009-03-05
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