Invention Grant
- Patent Title: Electrostatic chuck
- Patent Title (中): 静电吸盘
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Application No.: US11790635Application Date: 2007-04-26
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Publication No.: US07667943B2Publication Date: 2010-02-23
- Inventor: Akio Nakano , Ryuichi Handa , Ikuo Sakurai
- Applicant: Akio Nakano , Ryuichi Handa , Ikuo Sakurai
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-124971 20060428
- Main IPC: H01L21/683
- IPC: H01L21/683

Abstract:
An electrostatic chuck comprises an insulating layer with an electrode embedded therein and having a surface to come in contact with a workpiece to be held. Formed on the insulating layer surface is a silicone rubber layer which is filled with reinforcing silica, but free of another filler having an average particle size of at least 0.5 μm. The ESC allows for an intimate contact with a wafer and has an improved cooling capacity.
Public/Granted literature
- US20070253139A1 Electrostatic Chuck Public/Granted day:2007-11-01
Information query
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