Invention Grant
- Patent Title: Electronic control device and method of manufacturing electronic control device
- Patent Title (中): 电子控制装置及电子控制装置制造方法
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Application No.: US12153117Application Date: 2008-05-14
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Publication No.: US07667971B2Publication Date: 2010-02-23
- Inventor: Tsutomu Tominaga , Takayuki Kifuku , Shuzo Akiyama , Masaaki Tanigawa
- Applicant: Tsutomu Tominaga , Takayuki Kifuku , Shuzo Akiyama , Masaaki Tanigawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-294200 20071113
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
Provided is an electronic control device, including: a housing (3) which includes opening portions at both end portions thereof and is made of insulating resin; a heat sink (5) attached to one of the end portions of the housing (3); a power device (2) provided to the heat sink (5); a circuit board (4) which is provided so as to be opposed to the heat sink (5) and formed with an electronic circuit including a control circuit for controlling the power device (2); and a plurality of first conductive plates (6) held in the housing (3), for electrically connecting the circuit board (4) with the power device (2), in which each of the plurality of first conductive plates (6) includes a press fit terminal (6bp) press-fitted into a through hole (4a) formed in the circuit board (4) to be bonded to the circuit board (4) on a surface opposed to the circuit board (4) and to be bonded to respective terminals of the power device (2) on a surface opposed to the heat sink (5). Accordingly, an electronic control device whose size and cost are reduced and whose electrical connection reliability is improved is obtained.
Public/Granted literature
- US20090122489A1 Electronic control device and method of manufacturing electronic control device Public/Granted day:2009-05-14
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