Invention Grant
- Patent Title: Connector with a heat sink
- Patent Title (中): 带散热器的连接器
-
Application No.: US11798269Application Date: 2007-05-11
-
Publication No.: US07667972B2Publication Date: 2010-02-23
- Inventor: Wu-Hsiung Chen , Wen-Ta Chiu
- Applicant: Wu-Hsiung Chen , Wen-Ta Chiu
- Applicant Address: TW Taipei Hsien
- Assignee: Chant Sincere Co., Ltd.
- Current Assignee: Chant Sincere Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01R12/18

Abstract:
A connector with a heat sink to prevented a card from being damaged due to friction when the card is inserted or removed includes a frame provided with two guide arms and two elastic members, each guide arm containing two chutes, each chute containing an upper and a lower limit zones; a pressurizing-down mechanism connected to the frame, a leading post received in the chute being disposed on each side arm, and a heat sink being provided on top; card insertion driving the pressurizing-down mechanism to move with its leading post in the chute for the heat sink to contact the card to conduct the heat generated from the card; and the elastic member moving the pressurizing-down mechanism into the upper limit zone to remove the card.
Public/Granted literature
- US20080278914A1 Connector with a heat sink Public/Granted day:2008-11-13
Information query