Invention Grant
- Patent Title: Pattern evaluation method, method of manufacturing semiconductor, program and pattern evaluation apparatus
- Patent Title (中): 图案评估方法，半导体制造方法，程序和图案评估装置
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Application No.: US11192043Application Date: 2005-07-29
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Publication No.: US07668373B2Publication Date: 2010-02-23
- Inventor: Tadashi Mitsui
- Applicant: Tadashi Mitsui
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2004-223511 20040730
- Main IPC: G06K9/00
- IPC: G06K9/00
Abstract:
A pattern evaluation method includes: acquiring an image of a pattern to be evaluated, detecting edge points of the pattern from the image, creating a parameter curve having the detected edge points as control points thereof, and evaluating the pattern based on the created parameter curve.
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