Invention Grant
- Patent Title: Method and apparatus for randomizing dispatch order for single wafer processing
- Patent Title (中): 随机分配单晶片处理顺序的方法和装置
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Application No.: US11866060Application Date: 2007-10-02
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Publication No.: US07668615B2Publication Date: 2010-02-23
- Inventor: Gerald L. Goff , Leslie Marshall , Donald C. Likes
- Applicant: Gerald L. Goff , Leslie Marshall , Donald C. Likes
- Applicant Address: KY Grand Cayman
- Assignee: GlobalFoundries, Inc.
- Current Assignee: GlobalFoundries, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Williams, Morgan & Amerson, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G06F7/00
Abstract:
A method for dispatching wafers for processing in a tool includes identifying a queue of wafers available to be processed in the tool. One of the wafers is randomly selected based at least in part on a length of time each wafer has been in the queue. The selected wafer is dispatched for processing in the tool.
Public/Granted literature
- US20090088882A1 METHOD AND APPARATUS FOR RANDOMIZING DISPATCH ORDER FOR SINGLE WAFER PROCESSING Public/Granted day:2009-04-02
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