Invention Grant
US07669094B2 Semiconductor device and inspection method of semiconductor device and wireless chip
有权
半导体器件和无线芯片的半导体器件和检测方法
- Patent Title: Semiconductor device and inspection method of semiconductor device and wireless chip
- Patent Title (中): 半导体器件和无线芯片的半导体器件和检测方法
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Application No.: US11494466Application Date: 2006-07-28
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Publication No.: US07669094B2Publication Date: 2010-02-23
- Inventor: Hiroki Dembo
- Applicant: Hiroki Dembo
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2005-228639 20050805
- Main IPC: G01C29/00
- IPC: G01C29/00

Abstract:
The invention provides an inspection method of a semiconductor device which receives a test program wirelessly. As an inspection method of the semiconductor device, a test program is transmitted as a communication signal for every test. By transmitting a test program as a communication signal wirelessly in the case of an operation test, test contents are changed as required. As a result, a test program can be easily changed and an inspection circuit or the like is not required. In this manner, manufacturing cost of a wireless chip can be reduced.
Public/Granted literature
- US20070029994A1 Semiconductor device and inspection method of semiconductor device and wireless chip Public/Granted day:2007-02-08
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