Invention Grant
US07669100B2 System and method for testing and providing an integrated circuit having multiple modules or submodules 有权
用于测试和提供具有多个模块或子模块的集成电路的系统和方法

  • Patent Title: System and method for testing and providing an integrated circuit having multiple modules or submodules
  • Patent Title (中): 用于测试和提供具有多个模块或子模块的集成电路的系统和方法
  • Application No.: US11683607
    Application Date: 2007-03-08
  • Publication No.: US07669100B2
    Publication Date: 2010-02-23
  • Inventor: Perry H. Pelley
  • Applicant: Perry H. Pelley
  • Applicant Address: US TX Austin
  • Assignee: Freescale Semiconductor, Inc.
  • Current Assignee: Freescale Semiconductor, Inc.
  • Current Assignee Address: US TX Austin
  • Agent Robert L. King; Susan C. Hill
  • Main IPC: G01R31/3193
  • IPC: G01R31/3193 G01R31/40
System and method for testing and providing an integrated circuit having multiple modules or submodules
Abstract:
In an integrated circuit having a plurality of modules and/or submodules that each performs a substantially same function, defective modules and/or submodules are determined by creating a test signature from an input test pattern. The output of each module and/or submodule is compared with the test signature and defective modules to identify defective modules and/or submodules. The identity of defective modules/submodules is stored on the integrated circuit for subsequent use by a customer. Integrated circuits having one or more defective modules/submodules are sold to customers with full disclosure of which modules/submodules are defective, thereby improving the yield associated with the product. Pricing of the product is discounted for products with less than full functionality.
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