Invention Grant
- Patent Title: Embedded system employing component architecture platform
- Patent Title (中): 嵌入式系统采用组件架构平台
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Application No.: US10654149Application Date: 2003-09-03
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Publication No.: US07669197B1Publication Date: 2010-02-23
- Inventor: Patrick O'Neill , Bindu Rama Rao , Eugene Wang
- Applicant: Patrick O'Neill , Bindu Rama Rao , Eugene Wang
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06F9/45

Abstract:
Disclosed herein is a component architecture platform (CAP) framework that provides a mechanism to update firmware, drivers, and/or application software in an embedded system, such as in mobile electronic devices. The framework also facilitates access to generated update packages by the embedded system and provides updates to firmware, drivers, content or application software in a fault tolerant mode. Generation of update packages is more efficient and the update packages employing CAP are more compact than prior solutions. A distributed version of CAP, (DCAP), also provides access to functionality or components located at remote locations on other platforms.
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