Invention Grant
- Patent Title: Workpiece with a recess which is closed from the exterior by means of a solder film and method for closing a recess by means of a solder film
- Patent Title (中): 具有通过焊料膜从外部封闭的凹部的工件和通过焊料膜闭合凹部的方法
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Application No.: US10497277Application Date: 2002-12-18
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Publication No.: US07669326B2Publication Date: 2010-03-02
- Inventor: Andre Jeutter , Silke Settegast
- Applicant: Andre Jeutter , Silke Settegast
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: EP01130728 20011221
- International Application: PCT/EP02/14501 WO 20021218
- International Announcement: WO03/053622 WO 20030703
- Main IPC: B23P6/00
- IPC: B23P6/00 ; B63H1/26
Abstract:
It is known from the prior art that holes in a workpiece are filled completely with a solder powder, which leads especially in the case of large holes to the formation of cracks within the solder due to the large volume filled in once the solder cools off after soldering. The invention provides a method for closing a recess of a workpiece, which allows closing an opening of a recess without the risk of crack formation, by using only a solder film for closing the recess. The solder film has a content of non-melting material and therefore is substantially less prone to form cracks.
Public/Granted literature
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