Invention Grant
- Patent Title: Apparatus of fabricating and method of fabricating liquid ejection head, and liquid ejection head
- Patent Title (中): 制造液体喷射头的制造方法和液体喷射头
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Application No.: US12053470Application Date: 2008-03-21
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Publication No.: US07669329B2Publication Date: 2010-03-02
- Inventor: Hideyuki Ogawa , Koichi Saito , Nagamitsu Takashima , Katsumi Motojima , Katsunori Ono
- Applicant: Hideyuki Ogawa , Koichi Saito , Nagamitsu Takashima , Katsumi Motojima , Katsunori Ono
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2004-274623 20040922
- Main IPC: B23P17/00
- IPC: B23P17/00

Abstract:
A method of fabricating a liquid ejection head is provided. The method includes preparing a first die including projected streak portions aligned in parallel by a predetermined pitch and gap portions formed between the adjacent projected streak portions. The first die is adapted to form groove-like recess portions by pressing the projected streak portions to a metal plate. The method further includes preparing a second die for supporting the metal plate to which the projected streak portions of the first die are pressed. Each of the projected streak portions includes: an inner wall forming portion for forming an inner wall of the corresponding groove-like recess portion extending in a depth direction of the corresponding groove-like recess portion; a connecting face portion; and an inclined face portion, continuous via the connecting face portion to the inner wall forming portion, for forming a bottom portion of the corresponding groove-like recess portion into a substantially V-like shape.
Public/Granted literature
- US20080172854A1 APPARATUS OF FABRICATING AND METHOD OF FABRICATING LIQUID EJECTION HEAD, AND LIQUID EJECTION HEAD Public/Granted day:2008-07-24
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