Invention Grant
- Patent Title: Modular underfloor distribution system
- Patent Title (中): 模块化地板下配电系统
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Application No.: US10736820Application Date: 2003-12-15
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Publication No.: US07669371B2Publication Date: 2010-03-02
- Inventor: John William Hill
- Applicant: John William Hill
- Applicant Address: US CT West Hartford
- Assignee: The Wiremold Company
- Current Assignee: The Wiremold Company
- Current Assignee Address: US CT West Hartford
- Agency: McAndrews, Held & Malloy, Ltd.
- Main IPC: E04B5/00
- IPC: E04B5/00
Abstract:
An underfloor distribution system, includes a first module having a main body; an end closure and a cover. The end closure and the cover are removably mounted to the main body, and the first module is adapted to be removably mounted to a second module.
Public/Granted literature
- US20050126097A1 Modular underfloor distribution system Public/Granted day:2005-06-16
Information query
