Invention Grant
- Patent Title: Structural insulated panel and panel joint
- Patent Title (中): 结构绝缘板和面板接头
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Application No.: US11052465Application Date: 2005-02-07
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Publication No.: US07669372B2Publication Date: 2010-03-02
- Inventor: Lisa Clear Schaffer
- Applicant: Lisa Clear Schaffer
- Applicant Address: US OH Hamilton
- Assignee: T. Clear Corporation
- Current Assignee: T. Clear Corporation
- Current Assignee Address: US OH Hamilton
- Agency: Wood, Herron & Evans, LLP
- Main IPC: E04C1/40
- IPC: E04C1/40

Abstract:
An improved structural insulated panel and panel joint includes a panel having a core with cementitious facings where the core edge is grooved and along the panel side edges rebated to accommodate a connecting column. A connecting column is “H”-shaped, formed from two “C”-shaped channels sealed together along other webs with legs directed outwardly and for use between two of the panels. Multiple wall structures and details are disclosed.
Public/Granted literature
- US20060185305A1 structural insulated panel and panel joint Public/Granted day:2006-08-24
Information query
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