Invention Grant
- Patent Title: Heat pump apparatus
- Patent Title (中): 热泵设备
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Application No.: US10564033Application Date: 2005-04-26
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Publication No.: US07669430B2Publication Date: 2010-03-02
- Inventor: Keizo Matsui , Hiroshi Hasegawa , Fumitoshi Nishiwaki
- Applicant: Keizo Matsui , Hiroshi Hasegawa , Fumitoshi Nishiwaki
- Applicant Address: JP Kadoma-shi
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Kadoma-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2004-130567 20040427
- International Application: PCT/JP2005/007898 WO 20050426
- International Announcement: WO2005/103584 WO 20051103
- Main IPC: F25B9/00
- IPC: F25B9/00

Abstract:
The present invention realizes a reliable heat pump apparatus and heat pump apparatus having high recovering efficiency. The heat pump apparatus includes an expander 711 for expanding working fluid, a permanent magnet type synchronization power generator 710 which is disposed for recovering power by the expander 711 and which generates three phase AC power, and a first converter 708 which converts the AC power to DC power, and which rotates the power generator 710 at a predetermined target number of revolutions by switching of a switching element group 709. The generated electricity is consumed by connection of an AC power supply 701 to a DC power line which is rectified and smoothened by a rectifier circuit 702 and a smoothing capacitor 703, and by driving of an electric motor 706 which rotates a compressor 707 through a motor drive apparatus 704, and the power is efficiently recovered.
Public/Granted literature
- US20070266720A1 Heat Pump Apparatus Public/Granted day:2007-11-22
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