Invention Grant
- Patent Title: IC card module
- Patent Title (中): IC卡模块
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Application No.: US11907911Application Date: 2007-10-18
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Publication No.: US07669773B2Publication Date: 2010-03-02
- Inventor: Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
- Applicant: Hirotaka Nishizawa , Takashi Totsuka , Kenji Osawa , Junichiro Osako , Tamaki Wada , Michiaki Sugiyama
- Applicant Address: JP Tokyo
- Assignee: Renesas Technology Corp.
- Current Assignee: Renesas Technology Corp.
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge P.C.
- Priority: JP2004-140699 20040511
- Main IPC: G06K19/06
- IPC: G06K19/06 ; G06K7/06 ; G06K5/00

Abstract:
To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals. The first and second external connecting terminals respectively include signal terminals electrically separated from one another.
Public/Granted literature
- US20080257967A1 IC card module Public/Granted day:2008-10-23
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