Invention Grant
US07669780B2 Fluid supply nozzle, substrate processing apparatus and substrate processing method
失效
流体供应喷嘴,基板处理装置和基板处理方法
- Patent Title: Fluid supply nozzle, substrate processing apparatus and substrate processing method
- Patent Title (中): 流体供应喷嘴,基板处理装置和基板处理方法
-
Application No.: US12010962Application Date: 2008-01-31
-
Publication No.: US07669780B2Publication Date: 2010-03-02
- Inventor: Kou Sugano , Hiroshi Yoshioka
- Applicant: Kou Sugano , Hiroshi Yoshioka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-426845 20031224
- Main IPC: B05B17/04
- IPC: B05B17/04

Abstract:
A fluid supply nozzle includes a fluid flow-in section into which a fluid flows in, a reservoir section for storing the fluid, a flow velocity control wall provided between the fluid flow-in section and the reservoir section and including an orifice for making the fluid flow in the reservoir section while reducing a flow velocity, and a discharging section including a slit for discharging the fluid with pressure of the fluid applied to the reservoir section. A substrate processing apparatus is formed so as to include the fluid supply nozzle. Moreover, a substrate processing method includes the step of discharging a fluid in a single-layered, continuous film to supply the fluid onto a substrate. Thus, the substrate is processed. To perform this method, the fluid supply nozzle of the present invention can be used.
Public/Granted literature
- US20080203182A1 Fluid supply nozzle, substrate processing apparatus and substrate processing method Public/Granted day:2008-08-28
Information query