Invention Grant
- Patent Title: Backlight module
- Patent Title (中): 背光模组
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Application No.: US11954545Application Date: 2007-12-12
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Publication No.: US07670025B2Publication Date: 2010-03-02
- Inventor: Kuo-Chih Lee , Sheng-Chieh Chen , Chia-Hung Sun , Huang-Ti Lin
- Applicant: Kuo-Chih Lee , Sheng-Chieh Chen , Chia-Hung Sun , Huang-Ti Lin
- Applicant Address: TW Hsinchu
- Assignee: AU Optronics Corp.
- Current Assignee: AU Optronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Priority: TW96124118A 20070703
- Main IPC: F21V23/02
- IPC: F21V23/02

Abstract:
A backlight module comprising a back bezel, at least one light emitting device, a first circuit board, and a second circuit board is provided. The light emitting device, which has an electrode, is disposed on the side of the back bezel, while the first circuit board is disposed on the edge of the back bezel. An elastic clip is used to electrically connect the first circuit board directly with the electrode of the light emitting device, while the second circuit board is electrically connected to the first circuit board.
Public/Granted literature
- US20090009993A1 Backlight Module Public/Granted day:2009-01-08
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