Invention Grant
- Patent Title: High contact density miniature connector
- Patent Title (中): 高接触密度微型连接器
-
Application No.: US12138523Application Date: 2008-06-13
-
Publication No.: US07670061B2Publication Date: 2010-03-02
- Inventor: Philippe Gerard , Philippe Mallet
- Applicant: Philippe Gerard , Philippe Mallet
- Applicant Address: FR Versailles
- Assignee: Souriau
- Current Assignee: Souriau
- Current Assignee Address: FR Versailles
- Agency: Perman & Green LLP
- Priority: FR0704270 20070615
- Main IPC: G02B6/38
- IPC: G02B6/38

Abstract:
A miniature high density connector including a thermoplastic insulating body having contact cavities for the insertion, the positioning and the retention of electrical, optical or electro-optical contacts, a back plate having clips for the locking of the contacts into the contact cavities of the insulating body, a receptacle shell constituting an interface element for coupling with a complementary mating connector having a flange for the assembly and the retention of the insulating body and the back plate in the receptacle shell, the back plate being movable and including a projecting dimple located on the side wall, making possible its locking into the receptacle shell.
Public/Granted literature
- US20080317404A1 HIGH CONTACT DENSITY MINIATURE CONNECTOR Public/Granted day:2008-12-25
Information query