Invention Grant
- Patent Title: Sideload vanes for fluid pump
- Patent Title (中): 流体泵的侧负载叶片
-
Application No.: US11485830Application Date: 2006-07-13
-
Publication No.: US07670110B2Publication Date: 2010-03-02
- Inventor: Scott R. Erler , Michael H. Dills , Jose L. Rodriguez , John Eric Tepool
- Applicant: Scott R. Erler , Michael H. Dills , Jose L. Rodriguez , John Eric Tepool
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Kinney & Lange, P.A.
- Main IPC: F04D17/12
- IPC: F04D17/12

Abstract:
A fluid pump assembly includes a rotatable component that can be rotated about an axis and a static vane assembly located adjacent to the rotatable component. The static vane assembly includes a circumferential surface axially spaced from the rotatable component, and one or more vanes extending from the circumferential surface toward the rotatable component. The one or more vanes are configured to produce a radial load on the rotatable component when the rotatable component is rotating about the axis and a fluid is present between the static vane assembly and the rotatable component.
Public/Granted literature
- US20080014081A1 Sideload vanes for fluid pump Public/Granted day:2008-01-17
Information query