An injection molding apparatus includes a first mold half, a second mold half opposite to the first mold half, an eject pin, a component collector and a buffer device. The eject pin penetrates through the first mold half. The component collector is configured for receiving the molding component molded. The buffer device includes a buffer plate, a connection plate and an elastic element. The elastic element includes two elastic arms connected with each other. The two elastic arms form an angle θ in a range 0°