Invention Grant
- Patent Title: Injection molding apparatus
- Patent Title (中): 注塑设备
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Application No.: US11874302Application Date: 2007-10-18
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Publication No.: US07670134B2Publication Date: 2010-03-02
- Inventor: Han Sub Hwang , Sung Ki Min , Sang Hun Lee , Jong Won Lee
- Applicant: Han Sub Hwang , Sung Ki Min , Sang Hun Lee , Jong Won Lee
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2007-0006606 20070122
- Main IPC: B29C45/56
- IPC: B29C45/56 ; B29C45/66

Abstract:
An injection molding apparatus capable of minimizing cracks at the corners of a mold is provided. The injection molding apparatus includes first and second molds that mate with each other to define a molding cavity, a stationary member that supports the first mold, a movable member that supports the second mold and moves backwards and forwards together with the second mold, and a plurality of pressing members installed around the first mold so as to press a periphery of the first mold toward the molding cavity by a pressing force of the movable member when the first mold is mated with the second mold.
Public/Granted literature
- US20080175946A1 INJECTION MOLDING APPARATUS Public/Granted day:2008-07-24
Information query
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