A stack structure of the semiconductor packages and the manufacturing method thereof are disclosed herein. The packages of the present invention utilize plural stackable plug-receivers, which are similar to connectors, to stack and electrically connect with each other. The stack height of the stacked packages can be effectively reduced by utilizing the protrusion of a plug-receiver of one package to match with the concavity of a plug-receiver of another package at the corresponding position. Meanwhile, utilizing the stackable plug-receiver to replace the conventional soldering method can improve the warpage problem, and so as to promote the product reliability.