Invention Grant
- Patent Title: Low profile board-mounted connector
- Patent Title (中): 薄型板式连接器
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Application No.: US12157744Application Date: 2008-06-12
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Publication No.: US07670150B2Publication Date: 2010-03-02
- Inventor: Kazuhito Hisamatsu , Masaki Yamashita , Takahiro Yamaji , Tatsuya Shioda
- Applicant: Kazuhito Hisamatsu , Masaki Yamashita , Takahiro Yamaji , Tatsuya Shioda
- Applicant Address: JP Tokyo
- Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee: Japan Aviation Electronics Industry, Limited
- Current Assignee Address: JP Tokyo
- Agency: Collard & Roe, P.C.
- Priority: JP2007-175518 20070703
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An electrical connector mountable to a circuit board is disclosed. The disclosed connector includes a shell which comprises a first plate-like portion, a second plate-like portion and connection portions. The first plate-like portion extends in a predetermined direction and is provided with fixed portions at opposite ends thereof in the predetermined direction. The fixed portion is to be fixed to the circuit board. The second plate-like portion extends in the predetermined direction. Each of the connection portions connects the first and the second plate-like portion. The second plate-like portion is provided with force resist portions at opposite ends thereof in the predetermined direction. The force resist portions are configured so that, when a force is applied to the electrical connector along a direction from the first plate-like portion towards the second plate-like portion, the force resist portions resist the force.
Public/Granted literature
- US20090011623A1 Low profile board-mounted connector Public/Granted day:2009-01-08
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