Invention Grant
- Patent Title: Solderness cable assembly
- Patent Title (中): 焊锡电缆组件
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Application No.: US12322500Application Date: 2009-02-02
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Publication No.: US07670154B2Publication Date: 2010-03-02
- Inventor: Ya-Fei Yu , Xian-Kui Shi , Kevin Gao , Chung-Yen Yang
- Applicant: Ya-Fei Yu , Xian-Kui Shi , Kevin Gao , Chung-Yen Yang
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Priority: CN200820031472U 20080201
- Main IPC: H01R9/05
- IPC: H01R9/05

Abstract:
An cable assembly (100) includes an insulated housing (1) defining a plurality of contact slots; a plurality of contacts (2) accommodated in the contact slots, with tail portions thereof disposed outside of the insulated housing; at least a cable (4) including two wires (41) enclosed within a conductive shielding portion (43); a grounding member (3) including a main portion (31), a finger portion (33) extending forwardly from the main portion and a connecting portion (32) formed at a rear segment of the main portion, said connecting portion gripping outside of the conductive shielding portion of the cable; and the finger portion and inner conductors of the wires clamped by the tail portions of the contacts.
Public/Granted literature
- US20090197468A1 Solderness cable assembly Public/Granted day:2009-08-06
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