An burn-in socket used for connecting an IC package includes an base urged upward by springs, an actuated device floatably assembled on said base, a frame retained on said base, a plurality of contacts received in said base. Said actuated device includes a plurality of sustaining shafts with a plurality of rollers ringed thereon. Said latching assembly includes a plurality of rotating shafts retained on said base and a plurality of latching members engaged with said rotating shafts and rotating between an open position and a locking position. The actuated member when urged upwardly causes to rollers to press on back side faces of the latching members to rotate them between an open position and a closed position with lowered abrasion.