Invention Grant
- Patent Title: Modular jack assembly
- Patent Title (中): 模块化插座组件
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Application No.: US12069373Application Date: 2008-02-07
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Publication No.: US07670172B2Publication Date: 2010-03-02
- Inventor: Hong-Bo Zhang , Zheng-Hua Xu , Li-Chun Wu
- Applicant: Hong-Bo Zhang , Zheng-Hua Xu , Li-Chun Wu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Priority: CN200720034624 20070228
- Main IPC: H01R13/60
- IPC: H01R13/60 ; H01R13/66

Abstract:
A modular jack assembly includes first and second contact-holding inserts (10, 20) having first and second groups of interengaging elements (11 and 21, 12 and 22) between opposite bottom surfaces thereof. The first and second groups of interengaging elements are configured to interferentially engage the first contact-holding insert (10) with the second contact-holding insert (20) in respective first and second lateral and horizontal positioning directions (A, B). The second lateral and horizontal positioning direction (B) extends at approximately 90 degrees. from the first lateral and horizontal positioning direction (A). This arrangement will result in a reliable and stable positioning of the first contact-holding insert with respect to the second contact-holding insert.
Public/Granted literature
- US20080194140A1 Modular jack assembly Public/Granted day:2008-08-14
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