Invention Grant
- Patent Title: Modular jack with improved grounding member
- Patent Title (中): 具有改进接地构件的模块化插座
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Application No.: US12157547Application Date: 2008-06-10
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Publication No.: US07670173B2Publication Date: 2010-03-02
- Inventor: Jun-Hua Hu , Qing Wan , Li-Chun Wu
- Applicant: Jun-Hua Hu , Qing Wan , Li-Chun Wu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Main IPC: H01R13/66
- IPC: H01R13/66

Abstract:
A modular jack (100) adapted for receiving a pair of mating connectors includes an insulative housing (1) having a pair of cavities (10) for receiving the corresponding mating connectors, a number of terminal modules (3) received in the cavities for electrically connecting with the mating connector, and a conductive outer shield (2) enclosing the corresponding insulative housing. The modular jack further has a detachable grounding member (7) made from conductive material and electrically connected with the conductive outer shield for grounding. The grounding member has a number of contacting plates (7121,7131,7141) extending into the corresponding cavities for connecting and grounding the corresponding mating connectors.
Public/Granted literature
- US20080248695A1 Modular jack with improved grounding member Public/Granted day:2008-10-09
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