Invention Grant
US07670180B2 Shielded subminiature connection assembly and process of forming such an assembly 有权
屏蔽超小型连接组件及其组装过程

  • Patent Title: Shielded subminiature connection assembly and process of forming such an assembly
  • Patent Title (中): 屏蔽超小型连接组件及其组装过程
  • Application No.: US12138535
    Application Date: 2008-06-13
  • Publication No.: US07670180B2
    Publication Date: 2010-03-02
  • Inventor: Philippe GerardPhilippe Mallet
  • Applicant: Philippe GerardPhilippe Mallet
  • Applicant Address: FR Versailles
  • Assignee: Souriau
  • Current Assignee: Souriau
  • Current Assignee Address: FR Versailles
  • Agency: Perman & Green LLP
  • Priority: FR0704271 20070615; FR0704273 20070615
  • Main IPC: H01R13/648
  • IPC: H01R13/648
Shielded subminiature connection assembly and process of forming such an assembly
Abstract:
A shielded subminiature connection assembly having two subminiature connectors with housings provided with means of locking, two molded thermoplastic half-shells having a high contact density miniature sub-assembly with a molded thermoplastic insulating body provided with contact cavities for the positioning and retention of contacts, a back plate provided with a contact-retaining clip and whose sidewalls comprise projecting members, a molded thermoplastic receptacle shell including a flange provided with oblong apertures into which the projecting members of the back plate are locked. The disclosed embodiments also concern the process of forming the connection assembly.
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