Invention Grant
- Patent Title: Shielded subminiature connection assembly and process of forming such an assembly
- Patent Title (中): 屏蔽超小型连接组件及其组装过程
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Application No.: US12138535Application Date: 2008-06-13
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Publication No.: US07670180B2Publication Date: 2010-03-02
- Inventor: Philippe Gerard , Philippe Mallet
- Applicant: Philippe Gerard , Philippe Mallet
- Applicant Address: FR Versailles
- Assignee: Souriau
- Current Assignee: Souriau
- Current Assignee Address: FR Versailles
- Agency: Perman & Green LLP
- Priority: FR0704271 20070615; FR0704273 20070615
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A shielded subminiature connection assembly having two subminiature connectors with housings provided with means of locking, two molded thermoplastic half-shells having a high contact density miniature sub-assembly with a molded thermoplastic insulating body provided with contact cavities for the positioning and retention of contacts, a back plate provided with a contact-retaining clip and whose sidewalls comprise projecting members, a molded thermoplastic receptacle shell including a flange provided with oblong apertures into which the projecting members of the back plate are locked. The disclosed embodiments also concern the process of forming the connection assembly.
Public/Granted literature
- US20090004896A1 Sheilded sub-miniature connection assembly and process for equipping such a connection Public/Granted day:2009-01-01
Information query