Invention Grant
- Patent Title: Modular jack having an improved magnetic module
- Patent Title (中): 具有改进的磁性模块的模块化插座
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Application No.: US12416942Application Date: 2009-04-02
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Publication No.: US07670183B2Publication Date: 2010-03-02
- Inventor: Chao-Tung Huang , Jie Zhang , Yong-Chun Xu , Xiao-Hua Liu
- Applicant: Chao-Tung Huang , Jie Zhang , Yong-Chun Xu , Xiao-Hua Liu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee: Hon Hai Precision Ind. Co., Ltd
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Priority: CN200820034917 20080402
- Main IPC: H01R13/66
- IPC: H01R13/66
Abstract:
A modular jack (100) has a housing (10), a magnetic module (200) having a printed circuit board (21), a first and a second set of terminals (26, 221) mounted to the printed circuit board. The magnetic module includes a set of toroidal coil units (2) having a first core (23), a second core (24) and a third core (25), a number of first wires (233) wound around the first core and the third core, and a second wire (243) wound around the second core and the third core.
Public/Granted literature
- US20090253300A1 MODULAR JACK HAVING AN IMPROVED MAGNETIC MODULE Public/Granted day:2009-10-08
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