The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the substrate; and a plurality of linear elastic members which have tip ends and are implanted into the pellets, wherein upon contact of the tip ends of the linear elastic members with the polishing pad, the linear elastic members elastically deform, so that a pressure necessary for conditioning the pad is generated in order to maintain a change in conditioning capability within a predetermined range and have a wide margin for adjusting a height of the conditioner.