Invention Grant
- Patent Title: Rotating polishing tool
- Patent Title (中): 旋转抛光工具
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Application No.: US10592822Application Date: 2004-07-05
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Publication No.: US07670211B2Publication Date: 2010-03-02
- Inventor: Naomi Nishiki
- Applicant: Naomi Nishiki
- Applicant Address: JP Osaka
- Assignee: Taiyo Shokai Co., Ltd.
- Current Assignee: Taiyo Shokai Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- International Application: PCT/JP2004/009545 WO 20040705
- International Announcement: WO2006/003712 WO 20060112
- Main IPC: B23F21/03
- IPC: B23F21/03

Abstract:
The present invention has an object to provide a rotating polishing tool with high durability that can finish a polished surface with desired surface roughness. As means thereof, a substantially cylindrical polishing member 3 is constituted by a pair of polishing units 9 at opposite ends, and an intermediate portion 10 provided between the pair of polishing units 9. The polishing member 3 is rotatably supported around the central axis thereof, and polishes a polished surface with a peripheral surface thereof. The polishing unit 9 includes a plurality of abrasive cloth/paper sheets 7 pressingly held by an inner metal fitting 8, and forms peripheral edges of the abrasive cloth/paper sheets 7 into a serpentine shape. The intermediate portion 10 includes a plurality of laminated abrasive cloth/paper sheets 7 axially pressingly held by the polishing units 9. The intermediate portion 10 is caused to fit along the polishing units 9 to form the peripheral edge of each abrasive cloth/paper sheet 7 into a serpentine shape. No clearance is created between the abrasive cloth/paper sheets 7, thereby stabilizing surface roughness of the polished surface and increasing durability of the polishing member 3.
Public/Granted literature
- US20080160884A1 Rotating Polishing Tool Public/Granted day:2008-07-03
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