Invention Grant
US07670447B2 Method for applying adhesive to substrate, substrate, coating device, method for producing laminated object, and laminated object 有权
将粘合剂施加到基材,基材,涂布装置,层叠物的制造方法和层压体的方法

Method for applying adhesive to substrate, substrate, coating device, method for producing laminated object, and laminated object
Abstract:
A method for coating a substrate and a coating device used therein that can smoothly form an adhesive layer on the surface of a substrate without roughening, is provided which do not require a drying process and is free of various problems such as sick house syndrome stemming from use of organic solvents. In addition, a method of producing a laminated object using the coating method and the laminated object obtained thereby are provided. In the method for coating a substrate to form an adhesive layer on one surface of the substrate, while the substrate is being conveyed by applying a hot melt adhesive in a melted state via a rotating applicator roller, with the direction of rotation of the applicator roller and the direction of conveying the substrate being the same, adhesive is applied to the substrate while slipping the applicator roller by setting the circumferential speed of the applicator roller to be at least 20% slower or at least 20% faster than the predetermined speed at which the substrate is conveyed.
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