Invention Grant
- Patent Title: Separation apparatus and method
- Patent Title (中): 分离装置及方法
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Application No.: US11446965Application Date: 2006-06-06
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Publication No.: US07670452B2Publication Date: 2010-03-02
- Inventor: Babak Heidari , Mattias Habenicht
- Applicant: Babak Heidari , Mattias Habenicht
- Applicant Address: SE Malmo
- Assignee: Obducat AB
- Current Assignee: Obducat AB
- Current Assignee Address: SE Malmo
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: EP05104935 20050607
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
An apparatus and method are provided for separating two objects attached to each other in a sandwich structure, such as a stamp and a substrate pressed together in an imprint process. The apparatus includes a support structure, carrying first fastening means having a base surface and first gripping means for supporting and holding a first object, second fastening means, positioned opposite to the first fastening means, having second gripping means for holding a second object, and a pulling force mechanism to provide a pulling force at an angle to the normal direction of the base surface for displacing the two fastening means away from each other. Preferably, the second object is gripped at a periphery portion, and the pulling force is angled inwardly from said periphery portion.
Public/Granted literature
- US20070018358A1 Separation apparatus and method Public/Granted day:2007-01-25
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