Invention Grant
US07670539B2 Method and apparatus of injection molding using a heat-transfer enhancing layer 有权
使用传热增强层的注射成型的方法和装置

  • Patent Title: Method and apparatus of injection molding using a heat-transfer enhancing layer
  • Patent Title (中): 使用传热增强层的注射成型的方法和装置
  • Application No.: US11861136
    Application Date: 2007-09-25
  • Publication No.: US07670539B2
    Publication Date: 2010-03-02
  • Inventor: Myung-Ho Kang
  • Applicant: Myung-Ho Kang
  • Agency: Knobbe Martens Olson & Bear LLP
  • Priority: KR10-2005-0080158 20050830
  • Main IPC: B29C45/72
  • IPC: B29C45/72
Method and apparatus of injection molding using a heat-transfer enhancing layer
Abstract:
The injection molding apparatus includes a cavity mold formed with a cavity surface for defining a cavity in which a molten injection material is injected, a core mold formed with a core surface for defining the cavity upon engagement with the cavity mold and installed to be movable forward and backward to open or close the cavity by guidance of a guide pin, an injection unit for injecting a material into the cavity during an injection process, and an injection controller for controlling a hydraulic cylinder to move the core mold forward or backward and the injection unit to inject the material into the cavity.
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