Invention Grant
- Patent Title: Method and apparatus of injection molding using a heat-transfer enhancing layer
- Patent Title (中): 使用传热增强层的注射成型的方法和装置
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Application No.: US11861136Application Date: 2007-09-25
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Publication No.: US07670539B2Publication Date: 2010-03-02
- Inventor: Myung-Ho Kang
- Applicant: Myung-Ho Kang
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: KR10-2005-0080158 20050830
- Main IPC: B29C45/72
- IPC: B29C45/72

Abstract:
The injection molding apparatus includes a cavity mold formed with a cavity surface for defining a cavity in which a molten injection material is injected, a core mold formed with a core surface for defining the cavity upon engagement with the cavity mold and installed to be movable forward and backward to open or close the cavity by guidance of a guide pin, an injection unit for injecting a material into the cavity during an injection process, and an injection controller for controlling a hydraulic cylinder to move the core mold forward or backward and the injection unit to inject the material into the cavity.
Public/Granted literature
- US20080054527A1 INJECTION MOLDING APPARATUS AND METHOD OF USING THE SAME Public/Granted day:2008-03-06
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